[ Application & Application form ]
(pic : Free-Photos / 9129, pixabay.com)
○ Initial Team Build-up : No more than 4 people
max 4 persons comprise of 1 H/W developer or more, 1 S/W developer or more
※ Please note that 3D modeling, 3D printing, laser cutting, CNC engraving, PCB, SMT will be serviceable at Makerspace G·Camp
○ Development. Condition
- TIZEN (www.tizen.org) + (Service Cloud) SHInc Cloud, ThingsPark Cloud + Smart Things
One development board will be is issued to a team. but if you want other board, this wouldn't matter.
○ Application Form [Download application form below]
application_form_seoul_Hardware_hackathon_Top_Maker_English.docx
0.03MB
○ Submission and its Deadline
- Please fill it out the application and send it to us at Mr. Kitae Park, at Makerspace G·Camp, gitaepak@sba.kr / 02-2135-5280, 010-6785-3678
- Deadline: 25 July 2021
