(2021 Top Maker) Application & Application form

[ Application & Application form ]

 

(pic : Free-Photos / 9129, pixabay.com)

 

○ Initial Team Build-up : No more than 4 people

  max 4 persons comprise of 1 H/W developer or more, 1 S/W developer or more 

  ※ Please note that 3D modeling, 3D printing, laser cutting, CNC engraving, PCB, SMT will be serviceable at Makerspace G·Camp

 

○ Development. Condition

   - All teams shall use and develop Tizen Development board. 

    TIZEN (www.tizen.org) + (Service Cloud) SHInc Cloud, ThingsPark Cloud + Smart Things

    One development board will be is issued to a team. but if you want other board, this wouldn't matter. 

 

○ Application Form  [Download application form below]

application_form_seoul_Hardware_hackathon_Top_Maker_English.docx

0.03MB

 

○ Submission and its Deadline

 

 

  - Please fill it out the application and send it to us at Mr. Kitae Park, at Makerspace G·Camp, gitaepak@sba.kr / 02-2135-5280, 010-6785-3678   

   - Deadline: 25 July. 2021